Sikafast 555 L05 2-component adhesive (formerly 5215) 250ml

Capacity: 250ml

SikaFast 555 L05 is an acrylic, two-component, fast-curing, flexible structural adhesive. It has a pasty consistency, which allows for easy and precise application on both horizontal and vertical surfaces. It is suitable to replace mechanical fixing and provides very good adhesion to various substrates such as metals, plastics, glass and wood.

PRODUCT ADVANTAGES

• Durability in a few minutes after application
• Adheres to a wide range of substrates with no or limited surface preparation
• High strength and impact resistance
• Free from solvents and acids
• Weaker odor than products containing MMA

SCOPE OF APPLICATION

SikaFast 555 L05 is designed for quick fixing and can replace mechanical connections such as rivets, bolts or welding. It is suitable for creating strong, invisible bonds and exhibits excellent adhesion to a variety of substrates, including metals, plastics, glass, wood, etc.

The product is intended for experienced professional users only. Testing with actual substrates and conditions should be performed to ensure adhesion and material compatibility.

CURING MECHANISM

SikaFast 555 L05 cures by radical polymerization reaction. Variations in mixing ratio and temperature affect open time and fixing time. The higher the temperature, the shorter the open time and the fixing time, and vice versa.

APPLICATION METHOD

Surface preparation

Surfaces must be clean, dry and free of grease, oil and dust. Thoroughly remove all loose particles and residues. For best adhesion results on non-porous surfaces, prepare the surface to be bonded with Sika ADPrep prior to bonding. Due to the variety of materials, preliminary tests on original substrates are necessary.

App

SikaFast 555 L05 is applied at a 10:1 ratio by volume through a 24 element static mixer. It should be borne in mind that when applying large amounts of adhesive, a large amount of heat is generated as a result of the exothermic reaction. In order to limit excessive temperature rise, the joint thickness is limited to 3 mm but must not be less than 0.5 mm.

The optimum temperature for the bonding process is between 15 °C and 25 °C. The possible temperature range for substrates and adhesive is between 5 °C and 40 °C. Changes in product reactivity with temperature change must be taken into account.

After the open time has elapsed, the connected parts can no longer be moved relative to each other. After the fixing time is reached, the elements can be moved, provided that the adhesive joint is not subjected to additional stress.

SikaFast 555 L05 can be applied by pneumatic piston guns as well as by pump equipment. For advice on selecting and configuring a suitable pump system, please contact the Sika Industry Technical Department.

Removal

Excess SikaFast 555 L05 can be easily removed before curing with a dry cloth or with Sika Remover 208 or other suitable solvent. Once cured, the adhesive can only be removed mechanically. Hands and exposed skin should be washed immediately using Sika Cleaner 350H towels or a suitable industrial hand cleaner and water. Do not use solvents on the skin.

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